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Chip DSC 10 - DSC L66 Advance
Chip DSC 10 - DSC L66 Advance
Chip DSC 10 - DSC L66 Advance
Chip DSC 10 - DSC L66 Advance
Chip DSC 10 - DSC L66 Advance
Chip DSC 10 - DSC L66 Advance
Chip DSC 10 - DSC L66 Advance
Chip DSC 10 - DSC L66 Advance
Linseis
Chip DSC 10 - DSC L66 Advance
Chip DSC

Description

The Chip-DSC 10 (Chip-DSC L66 Advanced) integrates all essential parts of the DSC, heater, sensor and electronics in a miniaturized housing. The chip arrangement consists of a heater and temperature sensor in a chemically inert ceramic arrangement with a metallic heater and temperature sensor.

This arrangement enables high reproducibility and, due to the low mass, excellent temperature control and heating rates of up to 300 K/min.

The integrated sensor is easily replaceable and available at low cost.

The integrated design of the chip sensor provides excellent raw data, allowing direct analysis without pre- or post-processing of the heat flow data.

Chip technology

The world’s only chip DSC sensor with integrated heater and heat flux sensor.

Unsurpassed heating and cooling rates and time constants.

Benchmark resolution – precise separation of overlapping events

The unique sensor design enables excellent resolution and perfect separation of overlapping effects.

Highest sensitivity – for the detection of melts and weak transitions

The innovative chip design enabled us to develop a DSC sensor with the lowest possible mass.

This makes it possible to offer a heat flow DSC with an unsurpassed response rate.

Unsurpassed cooling speed – thanks to “low mass” chip sensor

Due to the low mass of our sensor, we can achieve unsurpassed cooling speeds, resulting in new applications and higher sample throughput.

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